search

UMD    AML






Department of Mechanical Engineering Professor Peter Sandborn was elevated to Institute of Electrical and Electronics Engineers (IEEE) Fellow, one of the highest distinctions awarded to IEEE members who have achieved innovation and excellence in the field of engineering.

Sandborn, who also serves as director of the Maryland Technology Enterprise Institute (Mtech), was recognized for his contributions to the analysis of cost and life-cycle of electronic systems.  Sandborn earned both his M.S. and Ph.D. in electrical engineering from the University of Michigan, and he became a professor at the University of Maryland in 1998. 

Sandborn is a professor in The Center for Advanced Life Cycle Engineering (CALCE) where his group develops obsolescence forecasting algorithms, performs strategic design refresh planning and lifetime buy quantity optimization. Sandborn also performs research in life cycle cost modeling areas including maintenance planning and return on investment analysis for the application of prognostics and health management (PHM) to systems, total cost of ownership of electronic parts, transition from tin-lead to lead-free electronics and general technology tradeoff analysis for electronic systems.

Established by a small group of engineers in 1884, IEEE has grown to become a global institution.  Their mission is to foster technological innovation and excellence in the field of engineering, for the betterment of humanity. 

An IEEE fellowship is one of the most prestigious awards granted by the institute, and less 0.1% of voting members are annually selected for this recognition.

For more information on Dr. Sandborn, visit his faculty webpage or his website.

For more information on IEEE, please visit their website.



Related Articles:
Ph.D. Student Abhishek Deshpande Awarded IEEE EPS Fellowship
Acevedo Wins Outstanding Student Paper Award at IEEE MEMS Conference for 3D Nanoprinting Breakthrough
IEEE Prognostics and Health Management StandardPublished by IEEE Reliability Society
Bar-Cohen Named President of IEEE Electronic Packaging Society
Yu Named ASME Fellow
Sandborn Awarded ASME Kos Ishii-Toshiba Award
Sandborn Publishes Second Edition of Cost Analysis of Electronic Systems
Schmidt Made ASME Fellow
Bruck Named SEM Fellow
Bar-Cohen Receives 2014 IEEE Components, Packaging and Manufacturing Technology Field Award

January 30, 2014


«Previous Story  

 

 

Current Headlines

Search Open for Full-Time Faculty Positions in Mechanical Engineering

Maryland Engineers Take On Big Challenges in Medicine

CEEE Study Explores How AI Can Reduce HVAC Energy Consumption

Justin Di Palo: Advancing Sustainable Living

Colton Honored with Microfluidics on Glass Award

How Much Wood Could a Heat Pump Dry?

Jump Start Program Gives CEEE Grad Students a Boost

UMD to Host International Graduate Engineering Course on Sustainability

State-of-the-Art 3D Nanoprinter Now at UMD

Das Named Pioneering Researcher by Chemical Communications

 
 
Back to top  
AML Home Clark School Home UMD Home ENME Home