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UMD Keystone Professor Bongtae Han (left) is presented with an Outstanding Sustained Technical Contribution Award by Prof. Jeffrey Suhling, President of the IEEE Electronics Packaging Society,
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Bongtae Han, Keystone Professor in the University of Maryland’s (UMD) Department of Mechanical Engineering, has been honored by the Electronic Packaging Society (EPS) of the Institute of Electrical and Electronics Engineers (IEEE) with its Outstanding Sustained Technical Contribution Award.
Han received the recognition in honor of his contributions to electronic packaging design for reliability and workforce development, and particularly for his work relating to measurement of advanced package behavior and material properties. The award was presented formally on May 28 at the 2026 Electronic Components and Technologies Conference in Orlando, FL.
A UMD faculty member since 1999, Han is director of the Laboratory for Optomechanics and Micro/Nano Semiconductors/Photonics Systems. He is a member of the Center for Advanced Life Cycle Engineering (CALCE), where he leads projects related to the reliability assessment of packaging materials, components, and assemblies.
His work has brought his numerous accolades, including the American Society of Mechanical Engineers’ Mechanics Award, the Society for Experimental Mechanics’ (SEM) Brewer Award, an IBM Excellence Award for Outstanding Technical Achievements; the Gold Award at the 1st Samsung Technical Conference; and a 2004 Best Paper Award from IEEE. He is a Fellow of both ASME and SEM.
In 2022, Han became editor-in-chief of Microslectronics Reliability, an Elsevier journal that is considered a flagship publication in the field of semiconductor packaging research.
June 16, 2026
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