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Associate Professor of Mechanical Engineering Bongtae Han was recently awarded the 2004 ASME Journal of Electronic Packaging Associate Editor of the Year Award. The award recognizes his technical and administrative service to the journal during the 2004 calendar year.
The award will be formally presented at the Electronic and Photonic Packaging technical division meeting during the 2006 ASME International Mechanical Engineering Congress & Exposition November 5-10 in Chicago, Illinois.
The department congratulates Professor Han for this outstanding achievement.
March 15, 2006
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