Dr. Preeti Chauhan (Ph.D. ’12) is a data center quality and reliability technical program manager (TPM) at Google. Previously, she was a quality and reliability TPM at Intel and led the assembly and test certification of Foveros 3D packaging technology and server microprocessors. She is a senior member of IEEE and co-editor of a data column in the magazine IEEE Computer. Chauhan is also an active member of the IEEE reliability society, a member of the board of directors for the International Reliability Physics Symposium (IRPS), and technical program committee chair for 2.5D/3D Packaging track in 2022 IRPS.
At UMD, Chauhan’s doctoral research focused on lead-free solder interconnect reliability. She is a recipient of the 2019 Intel Achievement Award for her contributions to development of industry-first 3D packaging technology for Intel processors and the 2017 Early Career Award from UMD’s A. James Clark School of Engineering in recognition of her professional achievements. Chauhan has authored a book on copper wire bonding and published more than 20 articles in peer-reviewed journals and conferences in the areas of electronic packaging reliability and prognostic health management.
I started my mechanical engineering journey with an undergraduate degree in India. I remember being super excited about material science and its applications in mechanical engineering. I continued on this journey with the Ph.D. program at UMD in order to pursue my interest and explore the field.
Who/what inspires you?
New challenges inspire me to find opportunities to push to the next level in all of my endeavors.
What has helped you to succeed in your overall personal and professional journey?
Openness to taking up new challenges and experiences has been an underlying theme in my personal and professional journey. It has led me to exciting opportunities and connected me with great people along the way.
What advice would you offer to current students?
Take risks and be open to trying new things, even when things are outside of your comfort zone.
What have been some of your greatest personal or professional successes?
Publishing a book on copper wire bonding (2013); receiving an early career award at UMD (2017); receiving Intel's highest achievement award, IAA (2019); leading the Young Professionals track for career development at the World Forum on Internet of Things (2021).
