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Kenny Mahan, Yong Sun, & Jingshi Meng |
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Mechanical engineering graduate students Kenny Mahan, Jingshi Meng, and Yong Sun received the George R. Irwin Centennial Research Award. Each year the Irwin Centennial Research Committee awards travel funds to one or more graduate students to subsidize travel costs so students can attend and present their research in the areas of fracture mechanics or experimental mechanics at technical meetings or conferences.
Mahan and Sun, advised by Dr. Bongtae Han, received $500 each to support travel to the ASME InterPACK 2013 held July 16-18 in San Francisco, Calif. They will present their technical paper on the adhesion and puncture strength of polyurethane coating used to mitigate tin whisker growth.
On receiving the award, Mahan stated, "I am sincerely thankful to the George R. Irwin Centennial Research Award Committee for this honor that it bestowed me, by supporting my attendance in this conference where I will be able to present the results of my research on fracture mechanics."
Sun, who was "pleased and honored to receive this award," looks forward to presenting his research, and he wished to "thank the committee for their generous evaluation."
Meng, advised by Dr. Abhijit Dasgupta, received a $400 award to attend the IEEE Electronic Components and Technology Conference held May 28-31 in Las Vegas, Nev. During the conference, Meng presented his paper on the effect of strain rate on adhesion strength of anisotropic conductive films (ACF) joints.
He was able to present his work to more than fifty experts from leading academic institutions and companies, and said, "This is a good chance to improve the quality of my work based on the feedback from different perspectives. George R. Irwin's [award] really helped me get this opportunity."
June 10, 2013
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